Advanced PCB Solutions
MCPCB, Aluminium PCB, or LED PCB are circuit boards which use a base metal material as the heat spreader. Aluminum PCB has good thermal conductivity, electrical insulation and mechanical processing properties.
MCPCB / Metal core PCB integrates a dielectric polymer layer with high thermal conductivity. Metal core PCB transfers heat 8–9 times faster than FR4 PCB.
Nexay has extensive experience manufacturing Aluminum PCB from single-sided to double-sided, mainly used in LED lighting industry.
Layer count: 1
Material: Polyronics TCB Aluminum base
Board thickness: 1.0mm
Thermal conductivity: 2.0W/m-K
Breakdown voltage: 3.0KV
Profile: Punch
Surface: HAL (Lead-free)
Application: High Power LED
Layer count: 2
Material: Bergquist HT-04503
Board thickness: 1.6mm
Copper thickness: 1oz
Thermal conductivity: 2.2W/m-K
Breakdown voltage: 6.0KV
Application: LED light
Layer count: 1
Material: Chaoshun CCAF-04
Board thickness: 1.2mm
Copper thickness: 2oz
Min trace width/spacing: 0.25/0.25mm
Thermal conductivity: 1.5W/m-K
Application: LED Street light
Layer count: 1
Material: Chaoshun CCAF-01
Board thickness: 1.6mm
Copper thickness: 1oz
Min hole size: 0.8mm
Thermal conductivity: 1.0W/m-K
Breakdown voltage: 4.0KV
Application: LED light
Nexay have been specializing in quick turn PCB prototype & small up to middle volume Rigid PCB for decade, our strong process capability ensure that we're able to meet most of your technical requirements and provide the highest quality. Moreover, With our clear market positioning on quick turn PCB manufacturing, our deliveries are guaranteed to be on time.
Layer: 4
Material: FR4(Tg170)
Finished copper thickness: 4oz on each layer
Min trace width/spacing: 0.3/0.4mm(12/16mil)
Application: Power controls, Heat Dissipation
Layer: 6
Thickness: 2.0mm
Surface treatment: ENIG + Hard gold plated on gold finger(Au: 30u")
Impedance control: Single-ended 50ohm, Differential 90ohm
Application: Computer
Layer: 8
Material: FR4(Tg180)
Min trace width/spacing: 0.3/0.3mm(12/12mil)
Surface treatment: Hard gold plating (Au: 50u")
Application: Military
Layer: 10
Material: Halogen-free FR4
Thickness: 1.6mm
Solder Mask: Matt Black
Special technology: Via in pad, resin-plugged hole on BGA area.
Layer: 6
Thickness: 2.4mm
Min through hole: 0.3mm
Min trace width/spacing: 4/4mil
Mechanical blind via L1-3 & L4-6: 0.2mm(8mil)
Application: Telecommunication
Layer: 12
Material: FR4
Thickness: 2.0mm
Min through hole: 0.3mm
Surface treatment: Gold Plating
Special technology: Gold plating on edge
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